Mosfet 300a



300v

Need a small MOSFET to handle 300A? The innovative package for your high current applications with a 30% footprint reduction whilst eliminating electromigration.

  1. Covering the full spectrum from low to high switching frequencies, these N-channel MOSFETs are ideal for applications such as SMPS, battery-powered motors, motor controls and drives, inverters and computers. This broad portfolio of OptiMOS™ and StrongIRFET™ solutions reduces footprint, boosts current ratings and optimizes thermal performance across all these and similar applications.
  2. Infineon’s TO-Leadless MOSFET package is optimized to handle currents of up to 300A, increasing power density with a substantial reduction in footprint. A footprint reduction of 30% compared to D 2 PAK, together with a height reduction of 50%, results in an overall space saving of 60% enabling much more compact designs.
  3. Cree CAS300M12BM2 Z-FET MOSFET and Z-Rec Diode Cree CAS300M12BM2 300A/1.2kV, all-silicon carbide half-bridge module is the largest current (lowest on-resistance) product available to the open market and manufactured in an industry standard 62mm housing that is prevalent in the high power industry.It is priced to impact mainstream markets like induction heating, active front end motor drives.
Mosfet 300a driver

N-channel 25 V, 0.72 mΩ, 300 A logic level MOSFET in LFPAK56 using NextPowerS3 Technology.

High current applications such as power tools, light electric vehicles and fork lifts often result in MOSFETs being used in parallel, driving up board space and cost - not any longer. Infineon’s TO-Leadless MOSFET package is optimized to handle currents of up to 300A, increasing power density with a substantial reduction in footprint. A footprint reduction of 30% compared to D2PAK, together with a height reduction of 50%, results in an overall space saving of 60% enabling much more compact designs.

Mosfet 300a Driver

The problem of electromigration is a challenge in high power and high temperature applications as well. Here again TO-Leadless is the ideal package solution. A 50% bigger solder contact area avoids electromigration leading to improvement in reliability. Infineon now offers nine voltage classes for OptiMOS™ in TO-Leadless ranging from 30V to 150V.